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Wuhan firm pioneers laser-cut SiC wafers

By Liu Kun in Wuhan and Wang Songsong? | chinadaily.com.cn | Updated: 2025-07-29 19:56

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A Chinese tech firm in Wuhan, Hubei province, has achieved a breakthrough in mass-producing silicon carbide (SiC) wafers at record speeds by using lasers instead of diamond wires. This marks a major technical advancement for electric vehicle makers working on faster charging systems. [Photo by Wei Lai/Provided to chinadaily.com.cn]

In May, the company's first SiC wafer cutting production line was put into operation in Optics Valley, a high-tech development zone in Wuhan, with an annual production capacity expected to exceed 30,000 wafers.

Si LAL plans to build four or five new production lines in Wuhan to create an expected annual output value exceeding 1 billion yuan ($139 million).

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